Abstract
UDC 621.396.6
The investigation has been performed of the process of the induction heating at the formation of solder balls from solder pastes on printed-circuit board contact pads. Application of the ring inductor with an internal magnetic circuit from ferrite has allowed us to concentrate the magnetic field power lines in the working zone and provide an optimum temperature profile of heating during mounting of the BGA packages with the speed of 40–50ºС/s.
Keywords: induction heating, solder balls, mounting, BGA package.