Rezumat
Constructive peculiarities and tehnical characteristics of multifunctional small-dimensional plasma unit for material treatment are given. The unit is intended for rough plasmachemical treatment of microelectronic, electronic, optic, etc. devices. For example, the unit provides threefold energy reduce while photoresist removing in relation to one 100 mm silicon wafer with simultaneous treatment acceleration 2–3 folds in comparison with industrial unit “Plasma-600T”.