Abstract
Parameters of the laser soldering and microwelding of electronics products are investigated and op- timized. Optimum modes of the laser soldering are: capacity 24 Wt, diameter of a beam of 2.5 mm, speed of moving 7 mm / with, productivity up to 300 contacts/minutes. Depth of fusion at microwelding linearly de- pends on energy of radiation, duration of a pulse and diameter of a laser beam.
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