КИНЕТИЧЕСКИЕ ХАРАКТЕРИСТИКИ ПРОЦЕССА БЕСКОНТАКТНОГО ХИМИКО-МЕХАНИЧЕСКОГО ПОЛИРОВАНИЯ ПЛАСТИН

Аннотация

The physical model for the non-contact chemo-mechanical polishing operations which are used in a process of manufacture of substructures was developed. The analytical expressions which are con- necting geometry and a velocity of treatment of a formed surface to physical parameters of flowing past processes were obtained. The velocity of treatment essentially depends on concentration of an active component of etchant, type of chemical reaction, physical properties of the sample and etchant. The comparison of experimental relationships of treated NaCl samples with theoretical expressions has shown their qualitative and good quantitative co-ordination. It allows to use conclusions of work for de- velopment an etchant and choice of optimum technological conditions for the operations of non-contact treatment of samples during manufacturing of substructures from semiconducting and ionic materials.

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